Device comprising weldbonded components

ABSTRACT

A method of assembling optoelectronic and/or photonic components, said method comprising: (i) providing at least two optoelectronic and/or photonic components; (ii) aligning and situating these components relative to one another and in close proximity with one another so as to: (a) provide optical coupling between these components; and (b) maintain the distance d between the adjacent parts of these components, where d is 0 to 100 μm; (iii) adhering these components to one another with while maintaining optical coupling therebetween; and (iv) laser welding these components together while maintaining optical coupling therebetween.

CROSS-REFERENCE TO RELATED APPLICATIONS

This application is a divisional of U.S. patent application Ser. No.12/276,786, filed on Nov. 24, 2008, the content of which is relied uponand incorporated herein by reference in its entirety, and the benefit ofpriority under 35 U.S.C. §120 is hereby claimed.

BACKGROUND OF THE INVENTION

1. Field of the Invention

The present invention relates generally to an improved method ofweldbonding, and more particularly to a method of weldbonding photonicor electro-optical components, and to devices comprising such weldbondedcomponents.

2. Technical Background

With rapidly increasing demand for photonic or opto-electronic devices(for example lasers or LED based portable or embedded projectors), oneof the biggest challenges in assembling these devices is connecting orjoining various components to one another to provide high opticalcoupling efficiency between these components, and maintaining theperformance of the assembled device stable over time and duringtemperature variations.

Laser welding has been used in a variety of applications in the assemblyof photonic components. During welding, the rapid solidification of thewelded parts and the associated material shrinkage can lead to arelative movement between the pre-aligned components (process inducedmisalignment). This is also referred to as Post Weld Shift (PWS). Theoptical output power and/or optical coupling efficiency between weldedphotonic or opto-electronic components may be significantly reduced byPWS.

The use of combined adhesive bonding and welding has been consideredpreviously for aero and auto applications. In these applications, largearea metal sheets are glued and welded to provide structural/strengthcharacteristics. This process is referred to as weldbonding. Theadhesive is sandwiched between the metal sheets and the welding isperformed subsequently through the sheets. The welding provides thebenefits of instant strength and high peel resistance, whereas theadhesive bonding provides fatigue and vibration resistance and improvedstrength and durability. The focus is on large area bonding andstructural requirements, not on high precision alignment, or opticalcoupling between components. Thus, to our knowledge, the weldbonding artdoes not address prevention of movement at the submicron level of thebonded parts during the welding process.

SUMMARY OF THE INVENTION

According to one aspect of the invention a method of assemblingoptoelectronic and/or photonic components, said method comprising: (i)providing at least two optoelectronic and/or photonic components; (ii)aligning and situating these optoelectronic and/or photonic componentsrelative to one another and in close proximity with one another so asto: (a) provide optical coupling between these components; and (b)maintain the distance d between the adjacent parts of said components,where 0 μm≦d≦100 μm; (iii) adhering said components to one another withadhesive by situating adhesive at a boundary between these componentsand curing or solidifying the adhesive while maintaining opticalcoupling therebetween; and (iv) laser welding said components together.According to at least some embodiments the laser welding is performed atthe boundary line between the two components. Preferably, the step oflaser welding creates at least one welding spot (i.e., weld bead) about50 μm to 1 mm in diameter.

Preferably, the laser welding step produces less than 1 μm shift, andmore preferably less than 0.5 μm shift in the relative positions of theadjacent components.

Preferably the adhesive is characterized by modulus of rigidity in therange of 5 GPa≦R≦100 GPa, and a cure time between 1 sec and 90 sec.Preferably the adhesive's contraction (i.e., linear shrinkage duringcuring) is less than 1 μm during curing or solidification. For example,in some embodiments, the thickness of the epoxy bond shrunk by less than10%, and in some embodiments by less than 5%, and in some embodiments byless than 1%. Preferably the adhesive is selected from the UV or heatcurable epoxies such as acrylates to facilitate quick curing process andeasy assembly process.

According to another embodiment of the present invention a devicecomprises: (i) at least two components situated proximate to oneanother, each of the two components including at least one opticalelement (i.e., optical, electro-optical or photonic element); (ii) atleast one optical element of at least one of the at least two componentsbeing optically coupled to at least one optical element of another oneof the at least two components; and (iii) at least one welding spot, andat least one spot of adhesive being situated at a periphery of theboundary formed between the two components.

Advantageously, the method of assembling optical, opto-electronic orphotonic components into a package, according to the embodiments of thepresent invention provides high yields, can be done at a relatively lowcost, and produces minimal (or no) post weld shift(s) of thesecomponents.

Additional features and advantages of the invention will be set forth inthe detailed description which follows, and in part will be readilyapparent to those skilled in the art from that description or recognizedby practicing the invention as described herein, including the detaileddescription which follows, the claims, as well as the appended drawings.

It is to be understood that both the foregoing general description andthe following detailed description present embodiments of the invention,and are intended to provide an overview or framework for understandingthe nature and character of the invention as it is claimed. Theaccompanying drawings are included to provide a further understanding ofthe invention, and are incorporated into and constitute a part of thisspecification. The drawings illustrate various embodiments of theinvention and together with the description serve to explain theprinciples and operations of the invention.

BRIEF DESCRIPTION OF THE DRAWINGS

FIG. 1A and FIG. 1B is a schematic depiction of one embodiment of thepresent invention;

FIGS. 2A and 2B are photographs of one embodiment of the presentinvention;

FIG. 3A is another schematic depiction of one embodiment of the presentinvention;

FIGS. 4A and 4B are photographs of another embodiment of the presentinvention;

FIG. 5 is a graph showing temperature fluctuation and output powerfluctuation as a function of time, for a device of FIG. 4A;

FIG. 6 is a graph showing output power fluctuation during ultrasonicvibration, as a function of time;

FIG. 7 is a schematic depiction of two components that are beingweldbonded together; and

FIG. 8 shows the measured mechanical displacements of the axisymmetricsurrogate test article schematically shown in FIG. 7.

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS

Reference will now be made in detail to the present preferredembodiments of the invention, examples of which are illustrated in theaccompanying drawings. Whenever possible, the same reference numeralswill be used throughout the drawings to refer to the same or like parts.One embodiment of the device of the present invention is shownschematically in FIG. 1, and is designated generally throughout by thereference numeral 10. FIG. 2A is a photograph of an exemplary builtdevice, and FIG. 2B illustrates an enlarged area of the device 10 shownin FIG. 2A. The device 10 includes: (i) at least two components 20(e.g., optoelectronic and/or photonic components) situated proximate toone another, each of these components including at least one optical,photonic, or optoelectronic element 21 (which are referred to herein asan optical element 21); (ii) at least one spot of adhesive 23 (adhesivebead) situated at a periphery of the boundary 25 formed between the twocomponents (iii) and at least one welding spot 28 situated at aperiphery of the interface or boundary 25 formed between the twocomponents. The optical element 21 of at least one of these twocomponents is optically coupled to at least one optical element 21 ofthe other component. Although the two optical elements 21 are opticallycoupled to one another, they may or may not be in physical contact withone another. Some examples of optical elements 21 are: waveguides (fiberor planar), lenses, lensed fibers, optical gratings, optical filters,optical couplers, optical or opto-electronic switches, optical frequencydoubling crystals, laser diodes, and/or optical isolators. Preferablythe adhesive 23 is characterized by modulus of rigidity in the range of5 GPa≦R≦100 GPa, and rapid curing rate (e.g., between 1 sec and 90 sec).Preferably the adhesive's contraction (i.e., linear shrinkage duringcuring) is less than 1 μm during curing or solidification. For example,in some embodiments, the thickness of the epoxy bond shrunk by less than10%, and in some embodiments by less than 5%, and in some embodiments byless than 1%.

In accordance with some embodiments of the present invention, a methodof assembling optoelectronic and/or photonic components 20 (alsoreferred to as components herein), comprises the steps of: (i) providingat least two optoelectronic and/or photonic components 20; (ii) aligningand situating the components 20 relative to one another and in closeproximity with one another so as to: (a) provide optical couplingbetween these components; and (b) maintain the distance d between theadjacent parts of these components, where d is 0 (components are inphysical contact with one another) to 100 μm; (iii) adhering or joiningthe two components to one another with an adhesive 23 (e.g., UV ortemperature curable epoxy) by: (a) situating the adhesive 23 at aboundary 25 between components 20, such that the two components are inphysical contact with the adhesive 23 and (b) curing or solidifying theadhesive 23 while maintaining the optical coupling between thesecomponents; and (iv) laser welding the components together at theboundary 25 (e.g., along the periphery of the boundary) to produce theassembled device 10. The laser welding creates welding spot(s) 28, forexample of 50 μm to 1 mm in cross-section (e.g., 200 μm to 600 μm indiameter). Preferably a plurality of welding spots 28 (also referredherein as weld spots) are created during the laser welding part of theprocess. If the adhesive requires UV curing, (for example a UV curableepoxy) the step of adhering the two components to one another with theadhesive 23 includes the step of UV curing the adhesive 23 to create apermanent bond between these components 20. The optical alignment and/oroptical coupling is maintained during laser welding by the structuralrigidity of the (solidified or cured) adhesive 23. As used herein, theterm “optical coupling” means that the two components are aligned suchthat if (or when) light is provided to an optical element of one of thetwo components (e.g., first component), the light will enter into theoptical element of the other component and will then exit from theoptical element of this other component. Thus, the two components or twooptical elements may be optically coupled to one another even when thelight is not provided to an optical element of one of the two components(e.g., to the first component), because they are positioned and alignedsuch that the if light is provided, it will couple from one of theelements to the other element. Advantageously, the laser welding stepproduces less than 1 μm shift in position of either one of the twowelded components. Preferably, the two components 20 shift by no morethan 1 μm relative to one another. Such small shifts do notsignificantly interfere with optical coupling efficiency E or withoptical output power P, which (assuming that the input optical power ismaintained at the same level) is preferably maintained within 20% andeven more preferably within 10%, i.e., P₂≧0.8 P₁ and more preferablyP₂≧0.9 P₁ where P₁ is the optical power throughput before the laserwelding step and P₂ is to the optical power throughput after laserwelding. Even more preferably, P₂≧0.95 P₁. This power change relates tothe post-weld shift and depends on the relative shifts between thealigned optical elements and their optical beam characteristics. In manyoptical, photonic or opto-electronic devices of interest (for example,Laser Diodes and single mode waveguides) the beam diameters are in therange of about 1 μm to about 10 μm, and it is preferable to limit thePWS to submicron levels to get less than 20%, and more preferably lessthan 10% relative change from P₁ to P₂. The optical coupling efficiencyE is also maintained within 20%, preferably within 10%. And morepreferably within 5%. (E=Pout/Pin), where Pin is an input optical powerprovided to an optical element of one of the two components, and Pout isan output optical power provided by an optical element of the othercomponent.). Thus, it is preferable that E₂≧0.8 E₁ and more preferablyE₂≧0.9 E₁ where E₁ is the optical coupling efficiency before the laserwelding step and E₂ is to the optical coupling efficiency after laserwelding. Even more preferably, E₂≧0.95 E₁.

According to some embodiments, the adhesive is an epoxy, and the step ofadhering the two (or more) components to each other includes a step ofchanging rigidity of the epoxy 23 to create a permanent bond between thetwo adjacent components 20. This can be done, for example, by UV curingthe applied adhesive 23 to make it rigid, attaching it to bothcomponents. The adhesive 23 may be a heat curable adhesive, which isapplied in a liquid form, and solidifies when exposed to heat.Alternatively an adhesive 23 may be applied as a hot liquid which thensolidifies (becomes more rigid) when exposed to a room temperature.Preferably, the adhesive changes its rigidity (solidifies or cures)within a few seconds (e.g., 1 sec to 90 sec, 1 sec to 60 sec, or 5 secto 45 sec) after its application, thus bonding the two componentstogether while maintaining their alignment within the desired level.

According to some embodiments the method also includes steps of: (i)measuring optical output power or optical coupling efficiency betweencomponents 20 prior to joining them one to another with said epoxy; and(ii) measuring optical output power or optical coupling efficiencybetween components 20 while adhering them one to another with epoxy 23.According to some embodiments the method also includes steps of: (i)measuring optical output power or optical coupling efficiency betweencomponents 20 prior to joining them one to another with said epoxy; and(ii) measuring optical output power or optical coupling efficiencybetween components 20 while measuring optical output power, or couplingefficiency between these components while laser welding them one toanother.

The optical coupling efficiency is defined as the ratio between outputoptical power (Pout) out of the optical element of the other component20, and input optical power (Pin) out of the optical element of theother component 20 (i.e., E=Pout/Pin), where the two optical elementsare optically coupled to one another. Thus, the coupling efficiency E₁between the two components 20 prior to joining them one to another withthe adhesive 23 is E₁=P₁/Pin. Similarly, coupling efficiency Ec betweensaid components while curing or solidifying the adhesive 23 is E_(C)=Pc/Pin. Similarly, coupling efficiency E₂ between these components whilelaser welding them one to another is E₂=P₂/Pin.

For example, according to some embodiments the method also includes thesteps of (i) measuring optical output power P₁, or coupling efficiencyE₁ between the two components 20 prior to joining them one to anotherwith the adhesive 23; (ii) measuring optical output power Pa, orcoupling efficiency Ea between these components while adhering them oneto another with the adhesive 23; (iii) measuring optical output powerP_(C), or coupling efficiency Ec between said components while curing orsolidifying the adhesive 23; (iv) measuring optical output power P₂, orcoupling efficiency E₂ between these components while laser welding themone to another.

Preferably the method of assembling optoelectronic and/or photoniccomponents 20 further includes steps of: (i) measuring optical outputpower P₁ or the optical coupling efficiency E₁ between the twocomponents 20 prior to adhering or bonding them together with theadhesive 23; and (ii) utilizing the mechanical strength and rigidity ofthe adhesive bond to maintain optical output power P₂, or the opticalcoupling efficiency E₂ between the two components 20 while laser weldingthe two components to each other such that: (a) the optical output powerafter welding is P₂≧0.8 P₁, and preferably P₂≧0.9 P₁.; and/or opticalcoupling efficiency E₂≧0.8 E₁, and preferably E₂≧0.9 E₁ Preferably,P₂≧0.95 P₁, more preferably P₂≧0.97 P₁. Preferably, E₂≧0.95 E₁, morepreferably E₂≧0.97 E₁.

According to some embodiments, laser welding is performed utilizing aNd:YAG laser with a wavelength of 1064 nm operated at 0.5 J to 2.5 J perweld spot, using a pulse width of 1 to 5 milliseconds, with a laser spotdiameter of 250 μm to 1 mm (e.g., 450 μm). However, laser welding can beperformed with other lasers, for example a CO₂ laser with a wavelengthof 10,600 nm, a frequency-doubled YAG with a wavelength of 532 nm, a 810nm laser, or an IR laser operating in the 1.3 μm to 1.5 μm wavelengthrange.

The optical components 20 may be made of materials which can be joinedusing laser welding, including metal (e.g., steel or aluminumsubstrates), metal-ceramic composite material, glass-ceramic material,glass or polymer materials. For example, the adhesive 23 may be utilizedto create bond between two metal components, a metal component and ametal-ceramic composite component, or two glass components. Laserwelding is then subsequently performed to weld the two bonded componentstogether. For example, two glass components can be laser welded to oneanother after they have been adhered to one another so that the desiredalignment is maintained during and after laser welding.

Beneficially, one advantage of the method according to the presentinvention is that it results in sub-micron shift between the two weldedcomponents 20, creating only minimal change in optical couplingefficiency between the welded components.

Thus, the method of weldbonding described herein advantageously preventsmovement of the bonded parts during the welding process (any residualmovement can be held at the submicron level), which is especiallyadvantageous for opto-electronic or photonic applications.

More specifically, the adhesive bond provides the rigidity to opposestresses that would misalign the optoelectronic subassemblies(components 20) during the subsequent laser welding process. In order toprevent movement of the bonded parts relative to one another during thewelding process, the adhesive needs to have (1) rigidity R to counterthe forces of laser welding, where preferably R>1 GPa, more preferablyR>5 GPA, for example 10 GPa≦R≦50 GPa, 15 GPa≦R≦30 GPa, or 18 GPa≦R≦25GPa; (2) negligible/low contraction (shrinkage) C during curing tomaintain the sub-micron alignment during the initial epoxy tacking ofthe opto-electronic sub-assemblies, wherein C<1 μm (preferably C≦0.5μm), and (3) rapid curing for low cost manufacturing. For example, insome embodiments, the thickness of the epoxy bond shrunk by less than10%, and in some embodiments by less than 5%. Thus, for example, if theoriginal epoxy bead thickness was 20 μm, after curing the epoxy bondthickness was not less than 19 μm, which means that the epoxy thicknesswas reduced by less than 5%. Preferably the curing time should be lessthan 90 sec, more preferably no more than 60 sec (e.g., 10-60 sec), andeven more preferably less than 10 sec. Examples of epoxies that can beused for this application include, but are not limited to, the“Optocast” brand of filled epoxies (available, for example, fromElectronic Materials Inc. of Breckenridge, Colo.). This brand of epoxyis a UV and/or heat curable one component epoxy with silica fillermaterial. Non-filled epoxy can also be used for this purpose as long asthe rigidity, cure time and contraction requirements are met. Suchmaterials include, for example, “Lens Bond” UV curable epoxies(available from Summers Optical Inc. of Hatfield, Pa.). These epoxiescome in different viscosity ranges. For example, in order to facilitatevery thin bond lines or spots for the adhesives, low viscosity adhesiveswith viscosity values in the range of 50-500 centipoise can be utilized.These adhesives are preferable when the distance between two componentsneeds to be small, for example d≦5 nm. The low viscosity adhesives canspread into the gap between the two components, providing more surfacecontact. However if the low viscosity adhesive is a UV curable adhesive,and spreads between the two components, it would be hard to completelycure such adhesive, unless the components are transparent. Furthermore,care has to be taken to not allow such adhesives to contaminate opticalelement(s) or to interfere with optical coupling by spreading into theoptical path. Thus, high viscosity adhesives, particularly filledepoxies with low shrinkage, may be preferable, because these adhesivesare less likely to spread into the optical path, and less likely tocontaminate optical elements. The high viscosity adhesives may haveviscosity values in the range of 500 to 100000 centipoise. In thefollowing examples we have chosen to use adhesives of high viscosity andapplied these adhesives on outside of the interface (or boundary)between the two components. High viscosity adhesives may require to beapplied in relatively large bead sizes to provide more surface contact.The bead diameters, or bead widths for high viscosity adhesives in thefollowing examples are 1 mm to 3 mm, but may be different, based on therequired application.

EXAMPLES

The invention will be further clarified by the following examples.

Example 1

According to one exemplary embodiment, two photonic components 20 wereassembled together to create a permanent bond therebetween. (See FIGS.1, 2A and 2B). More specifically, an optical element 21A (in thisexample, an optical fiber) was mounted on a metal substrate 22A, (inthis example stainless steel 304 substrate) and glued to the substrate,forming a first photonic component 20. Another photonic component 20 wasmade by mounting an optical fiber 21B on another substrate 22B. Notethat there is a wedge W on one of the mating surfaces 20A of the firstcomponent 20. The two photonic components 20 were situated in closeproximity to one another such that when light was provided to the inputend A of optical fiber waveguide 21A, the light exited from the outputend B of optical fiber waveguide 21B. The two photonic components 20were aligned for peak coupling (coupling that produces a maximum outputpower measured at the exit end B of the optical fiber waveguide 21B)band; and then glued in place using UV curable adhesive (e.g., OPTOCAST™3415, available from Electronic Materials, Inc., Breckenridge, Colo.)forming a “T” joint. Laser welding was subsequently performed on theglued assembly. In this exemplary embodiment we utilized a pulsed Nd:YAGlaser operated with a pulse width of 3 milliseconds, depositing anenergy of approximately 0.9 J per weld spot. In this exemplaryembodiment, the weld spot diameters d were approximately 450 microns.(See FIGS. 1 and 2A, 2B for the welding spot locations.)

The adhesive placement should be such that adhesive does not interferewith subsequent laser welding. In choosing the placement of the adhesive23, one should preferably take into account the symmetry of the devicedesign, such that any contraction of the adhesive 23 would generatenearly equal and opposing forces that cancel each other and minimize therelative shift between components 20. For example, it may be preferablethat adhesive beads be placed equidistantly from a component's center,or symmetrically around the perimeter of the smaller component. In thisexemplary embodiment the adhesive is a high viscosity adhesive, and itis applied on outside the interface between the components, in order toavoid possible wicking between components. Thus, is preferable toutilize adhesives with viscosities greater than 5000 centipoise, andmore preferably greater than 50,000 centipoise (Cps). For example,Opticast 3415 has a viscosity value of 100,000 Cps. The weld positionsare also preferably selected for symmetry and the production of counterbalancing forces. The laser pulse energy is preferably chosen such thateach pulse produces a residual force small enough to be easily withstoodby the rigid epoxy. Multiple weld spots are used to provide enoughstrength and reliability under operating conditions.

In this exemplary embodiment we measured optical coupling efficiency(optical output power) before and after the welding step. We had foundthat the joined components 20 had excellent coupling stability after thewelding step. The change in the output power measured as a result ofpost weld shift was less than 1% (i.e., P₂>0.99 P₁). In the initialexperiment, the metal substrate thickness was 6 millimeters. Later, thesubstrate thickness was modified to 1.5 millimeters and the experimentwas repeated. The change in the output power measured as a result ofpost weld shift in thinner assemblies was less than 3% (i.e., P₂>0.97P₁). Later, both of these assemblies (devices 10) were subjected tothermal cycling testing over temperature ranges from about 20° C. toabout 85° C. The optical output power variation during the thermalcycling was less than 3% (i.e., P₂ changed by less than 3%), thusdemonstrating excellent athermal behavior of the device 10. We thensubjected both assemblies (devices 10) to ultrasonic vibration with heat(50° C.) and 100% humidity (ultrasonic bath environment). Both devices10 demonstrated 0.3% output power variation. More specifically, FIG. 5shows the athermal behavior of the completed assembly shown in FIG. 4.FIG. 6 illustrates assembly performance under heat, humidity andvibration conditions.

Example 2

The method of aligning components and gluing them in place andperforming laser welding can extended to different mating surfacegeometries. In the above Example 1, the face of one of the matingsurfaces has a wedge. In this example, the surface is changed such thatthere is no wedge and the whole assembly looks like a “T” joint. (SeeFIG. 3 for the schematic drawing and FIGS. 4A and 4B for a photograph ofthe manufactured device 10). More specifically, FIG. 4A illustrates atop view of the device 10 and FIG. 4B illustrates a portion of the sideview of the manufactured device 10 of FIG. 4A. The average post-weldshift induced throughput power variation was about 1.8% (i.e., P₂>0.982P₁, including source fluctuations. In this exemplary embodiment, thermalcycling of the manufactured device 10 resulted in less than 2% variation(i.e., P₂ varied by less than 2%). This type of “T joint” geometry ispreferred because each component 20 can be a simple rectangular block.Another advantage with such T-Junction component assemblies is that,even with manufacturing variations in sizes and tolerances, the weldjoints will be symmetric and thus apply opposed transverse weld forces.That is, with balanced laser beam powers and placements, the resultingsymmetric weld locations (weld spot locations) apply equal and oppositeforces and to a large extent cancel each other, and the remaining forcesthat need to be compensated by the rigid epoxy bond are reduced.

Also, a preferred laser welding approach would involve using multiplesmaller pulses, which results in smaller welding spot sizes. Smallerwelding spots generally involve smaller forces that are easier tocounteract. Also, multiple welded areas would provide redundancy duringoperation and hence would lead to more reliable and durable devices. Inthis exemplary embodiment, the laser beam welds were made in the centerof the T-junction using two balanced laser beams, because this laserweld configuration provides the most symmetry in this exemplary device10. Similar factors (e.g., device geometry, adhesive placement location,location and number of weld spots) have to be taken into account forother device geometries when weldbonding together optical, photonic orelectro-optical components 20.

The excellent stability (e.g., small PWS values, and good opticalcoupling under different environmental conditions) obtained using thismethod of assembly is believed to be primarily due to the counter-forceprovided by the adhesive 23 to oppose the motions caused by the rapidsolidification of the molten material (e.g., metal, glass and/or glassceramic). Another cause could be the lever arm effect. The weld planealmost coincides with the plane of two waveguides (the distance betweenthe two waveguides 21A, 21B of this embodiment is less than 5 microns).During cooling of the welding spots 28, there could be rotationalmotions of the sub-assemblies (optical components 20) which could resultin the translation of the waveguides 21A, 21B relative to one another.If the weld plane was far removed from the optical coupling plane, largelateral displacements could occur on the optical coupling plane whichwould greatly reduce coupling efficiency. But, in the examples describedherein, the welding and optical coupling planes are nearly coincident,and thus the translations would be insignificant because the lever armis small. Thus, it is preferable, to have weld plane coincide or nearlycoincide (i.e., preferably within 1 mm) with the plane that the opticalelements are situated on.

Although in the second example the two components 20 were in physicalcontact with one another, this method was also shown to work when therewas an approximately 30 microns gap (d=30 μm) between the two matingsurfaces of the two components, with similar post weld shiftperformance.

Example 3

The present method of device assembly can also be applied toaxisymmetric devices. In this embodiment, stainless steel 304 devicesurrogates (i.e., components without optical elements) were assembledwith adhesives: some device surrogates were bonded using three smallbeads of cyanoacrylate gel (such as Super Glue Gel®, The Original SuperGlue Corporation, Rancho Cucamonga, Calif.) while the other surrogateswere made using a filled two part epoxy (such as J-B Kwik®, J-B WeldCompany, Sulphur Springs, Tex.). The cylindrically shaped metalsubstrate 22A (surrogate component 20) used in this example (see FIG. 7)were flanged, with a 45 degree taper and attached to the base surrogatecomponent 20′ (metal substrate 22A). The bonded device surrogates wereclamped into our test fixturing and component displacements in eachdevice surrogate were monitored using three Philtec RC20 fiber opticsensor displacement probes (Philtec, Annapolis, Md.). Other probes mayalso be utilized. The bonded device surrogates were welded with threebeams oriented 120 degrees apart and inclined at 25 degrees from theferrule centerline. The test configuration is illustrated schematicallyin FIG. 7. A relatively low power laser beam (in this example laserconditions were: 0.9 J per weld spot; 3 millisecond pulse width, andapproximately 450 μm welding spot) was directed onto the interfacebetween the two metal components. After the components have been weldedtogether, the lateral post-weld shifts were measured. A typical testresult from one of these device surrogates adhesively bonded usingcyanoacrylate gel is shown in FIG. 8. This figure shows the measuredmechanical displacements of the axisymmetric surrogate test device shownin FIG. 7. The three traces of FIG. 8 represent the output of the threedisplacement sensors. In FIG. 8 the y axis units are μm, and the x-axisrepresents time, measured in seconds.

Advantageously, the present method of weldbonding offers attractivefeatures such as micron-level accuracy joining of optical components,stability over temperature, and long term device reliability. That is,because the weldbonding joint is capable of holding the components 20with submicron precision.

Advantageously, the method of assembling opto-electronic or photoniccomponents into a package, according to the embodiments of the presentinvention, utilizes a modified weldbonding processes that minimizes thepost-weld shift to submicron levels, which makes this method suitablefor assemblies of photonic or opto-electronic devices or packages.

It will be apparent to those skilled in the art that variousmodifications and variations can be made to the present inventionwithout departing from the spirit and scope of the invention. Thus it isintended that the present invention cover the modifications andvariations of this invention provided they come within the scope of theappended claims and their equivalents.

What is claimed is:
 1. A device comprising: (i) at least two componentssituated proximate to one another, each of said two components includingat least one optical element; (ii) said at least one optical element ofat least one of said at least two components being optically coupled toat least one optical element of another one of said at least twocomponents; (iii) at least one welding spot, and at least one spot ofadhesive being situated at a periphery of the boundary formed betweenthe two components.
 2. The device according to claim 1 wherein saidadhesive is a UV or heat curable adhesive, a thermoplastic adhesive, athermosetting adhesive, a cyanoacrylate, a polyurethane, a silicone, ora polyimide.
 3. The device according to claim 1 wherein said at leastone welding spot has a cross-section of 250 μm to 1 mm.
 4. The deviceaccording to claim 1 wherein said at least two components are connectedto one another by at multiple adhesive spots and said adhesive spots aresituated symmetrically with respect to one another.